| PART |
Description |
Maker |
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| NP276-16951 NP276-25626 NP276-11904-3 NP276-59608 |
Ball Grid Array (BGA, 1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| SOT926-1 |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
|
NXP Semiconductors
|
| GRJ43DR73A333KWJ1 |
Chip Monolithic Ceramic Capacitor Soft Termination Type
|
Murata Manufacturing Co...
|
| GCJ219R71H334KA12 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GCJ188R92A473KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| 90143-0014 90143-0034 90143-0004 90143-0160 90143- |
Connector Housing; No. of Contacts:14; Pitch Spacing:2.54mm; No. of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 14 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; Number of Contacts:34; Pitch Spacing:2.54mm; Number of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp 34 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; No. of Contacts:4; Pitch Spacing:2.54mm; No. of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
C-Grid Modr Crp Hsg DR W/Pol Bttn 60Ckt 60 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
C-Grid Modr Crp Hsg DR W/Pol Bttn 20Ckt
|
Molex, Inc.
MOLEX INC
|
| JE10 JE1046ZTL2R JE10112HL1 JE10112HL1R JE10112HL2 |
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.1pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±1%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
MINIATURE HIGH POWER LATCHING RELAY 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.2pF; Voltage: 50V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
MINIATURE HIGH POWER LATCHING RELAY
|
HONGFA[Hongfa Technology]
厦门宏发电声股份有限公司
Xiamen Hongfa Electroacoustic Co., Ltd.
???瀹???靛０?′唤??????
|
| 1210B104XXX 1206Z104M250NXTM 0805N104XXX 1206B104X |
Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:24; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:20-24
Multilayer Ceramic Chip Capacitors
CERAMIC MULTILAYER CAPACITORS
|
Electronic Theatre Controls, Inc.
Novacap
http://
List of Unclassifed Manufacturers
|
| AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
